What are the applications of compressed air in the semiconductor chip industry?

In the semiconductor chip industry, compressed air is widely used in many key links because of its high cleanliness, stability and controllability. The specific applications and functions are as follows:

application of 1. Core Process

1. wafer Preparation and Cleaning
   • environmental Control: Compressed air maintains the clean room environment required for wafer preparation by adjusting temperature and humidity to prevent dust and moisture pollution.
   • Surface Cleaning: In the wafer cleaning stage, compressed air is used to purge the surface to remove tiny dust and residues, ensure that the wafer surface is dry and free of moisture, and avoid defects in subsequent processes.
2. lithography and etching
   • photoresist Treatment: Compressed air purges the photoresist surface to ensure uniform application and improve pattern transfer accuracy.
   • Etching assist during the etching process, compressed air helps to remove residues, ensuring the accuracy of the etching effect, while maintaining a stable pressure in the chamber to ensure the uniformity of the deposited layer.
3. Thin Film Deposition and Ion Implantation
   • pressure stability: Compressed air maintains stable pressure in the deposition chamber to ensure consistent film thickness.
   • Process protection: In ion implantation and other links, compressed air is used as a protective gas to prevent oxidation or contamination of the wafer surface.
4. Chip cutting and packaging testing
   • cutting support: Oil-free screw air compressor provides mechanical energy to ensure the quality of chip cutting and engraving.
   • Encapsulation Test: Compressed air is used to drive the packaging equipment to ensure the quality of the chip package and provide high-pressure gas support during the test phase.

Application of 2.-aided production links

1. device Driver and Automation Control
   • compressed air drives pneumatic valves, cylinders and other components to automate production lines, such as material handling, sorting and packaging.
2. Electrostatic spraying and printed circuit board cleaning
   • electrostatic spraying: Compressed air blows the raw materials into the electrostatic field to make the coating evenly adhere to the surface of the substrate.
   • PCB Cleaning: After production, use compressed air to clean the printed circuit board to remove dust and impurities and improve the purity of the circuit board.
3. Energy Recovery and Green Production
   • the energy recovery device uses the heat generated in the production process to reduce energy consumption and reduce waste, which is in line with the concept of green production.

3. Key Requirements and Equipment Selection

1. quality requirements
   • oil-free standard: The semiconductor industry requires compressed air to meet Class 0 zero oil-free standards to prevent oil from contaminating the wafer surface.
   • Dust control: The particle size should be controlled within 0.01μm to avoid small impurities affecting chip performance.
   • dew point control: The dew point temperature should reach -40 ℃ to -70 ℃ to ensure air dryness.
2. Equipment selection
   • oil-free screw air compressor: Provide oil-free, dry and stable compressed air to meet the needs of high cleanliness.
   • Centrifugal air compressor: Suitable for large-scale production, by adjusting the inlet valve and bypass discharge valve to maintain stable pressure.
   • Post-processing equipment: Including filters, dryers, etc., to further purify compressed air to ensure compliance with process requirements.

4. Application Case

• granklin solution provide oil-free screw air compressor (fixed frequency/frequency conversion) and post-processing products (such as filters, dryers) to provide stable and efficient compressed air support for semiconductor production lines.
• Advantages of screw air compressor in the packaging and testing phase, the screw air compressor has the characteristics of oil-free, low noise and high energy efficiency to ensure the air quality of chip testing and sorting and improve production efficiency.