What is the general gas supply pressure of semiconductor factory

In the semiconductor plant, the gas supply pressure varies depending on the type of gas and the process, as follows:

1. compressed air supply pressure

1. general Scope in most semiconductor manufacturing workshops, the design pressure of compressed air pipelines is usually 0.8MPa to ensure stable gas supply and meet the power requirements of the equipment. In actual operation, the pressure of compressed air will be adjusted according to specific process requirements. For example, the lithography area needs a stable and soft air flow with a pressure of about 0.5-0.7MPa. The etching area requires short and powerful pulses with a pressure range of 0.7-1.0MPa. The packaging area is similar to the continuous and stable gas supply of flute with a pressure of about 0.4-0.6MPa.
2. Special requirements for high-precision processes, such as EUV lithography, the compressed air system needs to integrate an oil-free screw compressor and PTFE membrane filter (0.01 μm) to achieve zero content of water, oil and particles (ISO 8573-1 Class 0), while the pressure needs to be stabilized in a specific range to prevent the failure of air springs and optical components.

2. nitrogen gas supply pressure

1. general Scope in most semiconductor manufacturing processes, such as photolithography, etching, deposition, etc., the inlet pressure of nitrogen is usually maintained between 0.62 and 0.76MPa (I. e. 6.2 and 7.6kg/cm²). This range can meet the nitrogen pressure requirements of most processes, ensuring process stability and product quality.

2. Special Process Requirements:

   • wafer nitrogen baking: The nitrogen pressure needs to be precisely controlled, e.g. to 0.03 to 0.05MPa, to avoid danger from excessive pressure.
   • chemical vapor etching chamber: The nitrogen pressure can be stabilized at 1500 to 2500 mTorr (1.5 to 2.5Torr, about 0.2 to 0.33MPa) to ensure the accuracy and consistency of the etching process.

3. Adjustable pressure range: Some nitrogen supply systems support adjustable pressure of 0-0.8MPa to meet the needs of different process links.

3. other special gas supply pressure

1. silane (SiH) Gas Pipeline the working pressure is generally controlled at 0.2-0.5MPa to reduce the risk of leakage and ensure production safety.
2. Hydrogen chloride (HCl) gas pipeline: The working pressure is mostly 0.1-0.3MPa to prevent pipeline corrosion and leakage from causing safety accidents due to excessive pressure.