Electronic semiconductor compressed air particulate requirements

In the electronic semiconductor industry, the particulate matter requirements for compressed air are extremely stringent, it is usually required that the number of particles greater than or equal to 0.1 microns per cubic meter of air does not exceed 3520 (100-level clean room standard), and some high-end processes even require ISO 1-level standards, I .e. the number of particles greater than or equal to 0.1 microns per cubic meter of air does not exceed 10. The following is a detailed analysis of the compressed air particulate requirements for the electronic semiconductor industry:

effects of 1. Particulate Matter Pollution on the Production of Electronic Semiconductors

• product Defect: Tiny particulate pollution may cause defects on the surface of semiconductor products, such as short circuit, unstable performance, etc., which will affect the yield and reliability of the product.
• Equipment damage particulate matter may also enter semiconductor production equipment, causing equipment wear, blockage or failure, increasing maintenance costs and downtime.

Specific Requirements for Compressed Air Particulate Matter in 2. Electronic Semiconductor Industry

• concentration of particulate matter: It is usually required that the number of particles greater than or equal to 0.1 microns per cubic meter of air does not exceed 3520 (100-level clean room standard). This standard aims to ensure the cleanliness of the production environment and prevent particulate matter from polluting semiconductor products.
• High-end process requirements: For some high-end processes, such as EUV lithography and other nanoscale processes, the requirements for compressed air particles are more stringent, and they must meet the ISO level 1 standard, that is, the number of particles greater than or equal to 0.1 microns per cubic meter of air does not exceed 10.

3. measures to achieve low particulate matter concentrations

• multistage filtration system: Adopt multi-stage filtration system, including coarse filter, fine filter, etc. to remove particles in compressed air. These filters capture particles of different sizes and ensure the cleanliness of the compressed air.
• High Efficiency Filter (HEPA/ULPA): In key process areas, such as photolithography and etching rooms, high-efficiency filters (HEPA/ULPA) are used to further purify the compressed air. These filters are more than 99.97 percent efficient for particles greater than or equal to 0.3 microns.
• Regularly replace the filter: In order to ensure the stable and reliable performance of the filter, the filter needs to be replaced regularly. Generally speaking, the replacement cycle of HEPA filters does not exceed 1 year, and the replacement cycle of ULPA filters does not exceed 6 months.

4. related standards and certifications

• ISO 14644-1 standard this standard defines the classification of air cleanliness in clean rooms and provides the basis for cleanliness control in the electronic semiconductor industry.
• ISO 8573-1 the standard defines the quality level of compressed air, including the control requirements for pollutants such as particulate matter, humidity and oil. The electronic semiconductor industry is required to follow this standard to ensure that the quality of compressed air meets production requirements.