Compressed air requirements for the semiconductor industry

Generally speaking, a semiconductor is a material, of which silicon is the most important element, including germanium, gallium arsenide, silicon carbide, etc. Semiconductor materials are processed into integrated circuits through a series of processes, which are then used in various electronic devices as we know them. Electronic devices closely related to daily activities, such as televisions, computers and mobile phones, are inseparable from the "full help" of semiconductors ". As the demand for electronic devices grows exponentially, the production of semiconductor components is also accelerating. Compressed air, which plays a key role in semiconductor production, is needed in large quantities.

Integrated circuits are extremely sophisticated parts of electronic devices, and a tiny grain of dust may cause the entire circuit to fail. For example, when the circuit board is in the initial manufacturing process, the micro-components are placed on the wafer/circuit board. At this time, these components are not connected to each other, and then compressed air is used to insert (squeeze) the solder into the microscopic holes on the circuit board, and if the compressed air is oily, it will cause damage to the expensive semiconductor components.

Therefore, its production process requires highly specialized technology and a harsh and clean environment. The use of 0 oil-free compressed air is not only a guarantee of high purity in a closed production environment, but also promotes productivity and reduces production losses due to pollution.

General gas quality requirements for semiconductor manufacturing are as follows:

1. Oil requirement 0.00ppm

2. Dust requirement 0.01μm

3. Dew point requirement -40 ℃ to -70 & sh; °C(PDP)

4. Exhaust pressure 0.8-0.85MPa

the main gas points are as follows:

1. Instrument gas

pneumatic components, precision instruments

2. Air separation gas

process protection gas (nitrogen making machine)

3. Process gas

purging, cleaning, cooling, scribing, epitaxy, etching and deposition, ion implantation

sorting, testing, packaging, assembly, packaging, transportation and handling, sewage treatment